Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>AMAOE BGA Reballing Stencil for F1P50320 CPU Tin Planting Net Lower Layer Anti-drum Cooling Hole Design Soldering Steel Mesh
AMAOE BGA Reballing Stencil for F1P50320 CPU Tin Planting Net Lower Layer Anti-drum Cooling Hole Design Soldering Steel Mesh

AMAOE BGA Reballing Stencil for F1P50320 CPU Tin Planting Net Lower Layer Anti-drum Cooling Hole Design Soldering Steel Mesh Item NO.: 3256805814141020

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Product Name AMAOE BGA Reballing Stencil for F1P50320 CPU Tin Planting Net Lower Layer Anti-drum Cooling Hole Design Soldering Steel Mesh
Item NO. 3256805814141020
Weight 0.1 kg = 0.2205 lb = 3.5274 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Brand AMAOE
Creation Time 2023-09-13

AMAOE BGA Reballing Stencil for F1P50320 CPU Tin Planting Net Lower Layer Anti-drum Cooling Hole Design Soldering Steel Mesh

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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