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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>AMAOE CPU reballing stencil kit U3 platform 0.12MM steel mesh for HI6250 MSM8916/8939 MSM8937/8940 MSM8952 MSM8953 B01

AMAOE CPU reballing stencil kit U3 platform 0.12MM steel mesh for HI6250 MSM8916/8939 MSM8937/8940 MSM8952 MSM8953 B01 Item NO.: 6852368

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US$ 2.31 ~ US$ 2.52

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 2.46	US$ 2.39	US$ 2.31

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Product Name	AMAOE CPU reballing stencil kit U3 platform 0.12MM steel mesh for HI6250 MSM8916/8939 MSM8937/8940 MSM8952 MSM8953 B01
Item NO.	6852368
Weight	0.3 kg = 0.6614 lb = 10.5822 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Brand	AMAOE
Creation Time	2023-02-26

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