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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>AMAOE Huawei Mate30Pro middle layer reballing kit 0.15MM 0.1MM position board/ base /4G/5G pcb middle layer steel mesh

AMAOE Huawei Mate30Pro middle layer reballing kit 0.15MM 0.1MM position board/ base /4G/5G pcb middle layer steel mesh Item NO.: 6836332

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US$ 2.31 ~ US$ 2.52

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 2.46	US$ 2.39	US$ 2.31

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Quantity: Stock ( 6012 )

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Product Name	AMAOE Huawei Mate30Pro middle layer reballing kit 0.15MM 0.1MM position board/ base /4G/5G pcb middle layer steel mesh
Item NO.	6836332
Weight	0.58 kg = 1.2787 lb = 20.4589 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Brand	AMAOE
Creation Time	2023-02-26

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