Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>AMAOE MBGA-B14 MBGA-U33 reballing platform Exynos CPU tin planting position board with CPU stencil
AMAOE MBGA-B14 MBGA-U33 reballing platform Exynos CPU tin planting position board with CPU stencil

AMAOE MBGA-B14 MBGA-U33 reballing platform Exynos CPU tin planting position board with CPU stencil Item NO.: 11400017

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US$ 2.13 ~ US$ 2.32
Quantity 0-10 11-50 ≥51
Discount 2% OFF 5% OFF 8% OFF
Price US$ 2.27 US$ 2.20 US$ 2.13
Model
U33 U34 U35 U36 U37 U38 Mbga-Base Mbga-B14 full set Mbga-B14 Positioning plate
Quantity

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Product Name AMAOE MBGA-B14 MBGA-U33 reballing platform Exynos CPU tin planting position board with CPU stencil
Item NO. 11400017
Weight 1.26 kg = 2.7778 lb = 44.4452 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag BGA reballing kit
Brand AMAOE
Creation Time 2023-02-26

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All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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