Home>Phone repair tools>BGA reballing kit>AMAOE Mbga-B18 Plant tin platform Snapdragon 855/845/SDM845/SM8150/RAM556 steel mesh
AMAOE Mbga-B18 Plant tin platform Snapdragon 855/845/SDM845/SM8150/RAM556 steel mesh

AMAOE Mbga-B18 Plant tin platform Snapdragon 855/845/SDM845/SM8150/RAM556 steel mesh Item NO.: 22208524

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Product Name AMAOE Mbga-B18 Plant tin platform Snapdragon 855/845/SDM845/SM8150/RAM556 steel mesh
Item NO. 22208524
Weight 1 kg = 2.2046 lb = 35.2740 oz
Category Phone repair tools > BGA reballing kit
Creation Time 2023-05-30

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

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