AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM Item NO.: 21406837

Write a Review

US$ 2.24 ~ US$ 2.44

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 2.39	US$ 2.31	US$ 2.24

Quantity: Stock ( 668 )

Estimate Shipping Cost

Product Name	AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM
Item NO.	21406837
Weight	0 kg = 0.0000 lb = 0.0000 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Brand	AMAOE
Creation Time	2023-02-26

Product Name	AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM
Item NO.	1318323
Smart device Brand	Android Samsung
BGA reballing kit	Stencil
Weight	0.04kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools> BGA reballing kit
Tag	SDM845 stencil SM 6150 SDM SM8150 MSM stencil SDM stencil CPU steel mesh Android stencil SDM845 0.12mm stencil 0.12mm 710 845 670 SDM845 CPU MSM8917 Android CPU stencil Samsung CPU stencil Qualcomm CPU stencil Samsung stencil Qualcomm 8150 MSM 0.12mm CPU stencil SDM710 SDM710 stencil Qualcomm stencil MSM8917 stencil 8917 SM stencil SM8150 RAM SM8150 CPU AMAOE 0.12MM stencil QU5 SDM670 SM6150 SDM845 CPU stencil SDM845 RAM SDM845 RAM stencil SM8150 CPU stencil SM8150 RAM stencil SDM670 stencil SM6150 stencil
Brand	AMAOE
Creation Time	2020-06-22

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.