Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>AMAOE Qualcomm CPU reballing stencil 0.12MM QU:1 QU:2 QU:3 QU:4 Qualcomm MSM series steel mesh QU1 QU2 QU3 QU4
AMAOE Qualcomm CPU reballing stencil 0.12MM QU:1 QU:2 QU:3 QU:4 Qualcomm MSM series steel mesh QU1 QU2 QU3 QU4

AMAOE Qualcomm CPU reballing stencil 0.12MM QU:1 QU:2 QU:3 QU:4 Qualcomm MSM series steel mesh QU1 QU2 QU3 QU4 Item NO.: 6853470

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US$ 2.38 ~ US$ 2.59
Quantity 0-10 11-50 ≥51
Discount 2% OFF 5% OFF 8% OFF
Price US$ 2.53 US$ 2.46 US$ 2.38
Model
QU1-0.12MM QU2-0.12MM QU3-0.12MM QU4-0.12MM
Quantity

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Product Name AMAOE Qualcomm CPU reballing stencil 0.12MM QU:1 QU:2 QU:3 QU:4 Qualcomm MSM series steel mesh QU1 QU2 QU3 QU4
Item NO. 6853470
Weight 0 kg = 0.0000 lb = 0.0000 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag BGA reballing kit
Brand AMAOE
Creation Time 2023-02-26

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All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

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