Home>Repair Tools>Phone Repair Tools>Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh
Amaoe MBGA-B5 BGA Reballing Set  Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh

Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh Item NO.: 1005005552831673

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US$ 6.42
Color
Full set Position board UBase Mbga-U5 Mbga-U6 Mbga-U7 Mbga-U8 Mbga-U9 Mbga-U10 Mbga-U11
Quantity

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Product Name Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh
Item NO. 1005005552831673
Weight 0.3 kg = 0.6614 lb = 10.5822 oz
Category Repair Tools > Phone Repair Tools
Creation Time 2023-06-01

Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

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