Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>Amaoe MQ1 2 3 4 5 BGA Reballing Stencil 0.12mm Qualcomm MTK CPU RAM IC Chip Steel Mesh Tin Planting
Amaoe MQ1 2 3 4 5 BGA Reballing Stencil 0.12mm Qualcomm MTK CPU RAM IC Chip Steel Mesh Tin Planting

Amaoe MQ1 2 3 4 5 BGA Reballing Stencil 0.12mm Qualcomm MTK CPU RAM IC Chip Steel Mesh Tin Planting Item NO.: 3256805755339752

Write a Review
US$ 6.97
Color
MQ1 MQ1-5 MQ4 MQ2 MQ5 MQ3
Quantity

Copy and share this link on social network or send it to your friends

Copy
Product Name Amaoe MQ1 2 3 4 5 BGA Reballing Stencil 0.12mm Qualcomm MTK CPU RAM IC Chip Steel Mesh Tin Planting
Item NO. 3256805755339752
Weight 0.1 kg = 0.2205 lb = 3.5274 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Brand AMAOE
Creation Time 2023-09-13

Amaoe MQ1 2 3 4 5 BGA Reballing Stencil 0.12mm Qualcomm MTK CPU RAM IC Chip Steel Mesh Tin Planting


Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process


 

No related record found