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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net

Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net Item NO.: 3256805735002536

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US$ 6.90

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Product Name	Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net
Item NO.	3256805735002536
Weight	0.1 kg = 0.2205 lb = 3.5274 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Brand	AMAOE
Creation Time	2023-09-13

Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process

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Amaoe Middle Layer BGA Reballing Stencil for Phone 11Pro Max A13 CPU Steel Network IC Chip Solder Tin Planting Net Item NO.: 3256805735002536

Warranty Service

Scope of Warranty

After Sales Service Process

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