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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template

Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template Item NO.: 12589373

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US$ 2.59 ~ US$ 2.82

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 2.76	US$ 2.67	US$ 2.59

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Product Name	Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template
Item NO.	12589373
Weight	0.16 kg = 0.3527 lb = 5.6438 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Brand	KAISI
Creation Time	2023-02-26

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process

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Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template Item NO.: 12589373

Warranty Service

Scope of Warranty

After Sales Service Process

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