Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template
Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template

Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template Item NO.: 12589373

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US$ 2.59 ~ US$ 2.82
Quantity 0-10 11-50 ≥51
Discount 2% OFF 5% OFF 8% OFF
Price US$ 2.76 US$ 2.67 US$ 2.59
Model
A14 A15 A16 A8-A16 (9pcs) iphone 6/6p iphone 6S/6SP iphone 7/7P iphone 8/8P/X iphone XS/XS MAX/XR 11 Pro max
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Product Name Kaisi Universal Multi Function Planting Tin Mesh BGA Reballing For iPhone FACE ID CPU NAND EMMC EMPC integrated Stencil Template
Item NO. 12589373
Weight 0.16 kg = 0.3527 lb = 5.6438 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag BGA reballing kit
Brand KAISI
Creation Time 2023-02-26

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All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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