Lead-Free Tin Paste Low Temperature And High Temperature Melting Point Tin Paste CPU Repair Item NO.: 1799986

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US$ 1.84 ~ US$ 2.00

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 1.96	US$ 1.90	US$ 1.84

Model: V3B45(20G)138° V4B45(40G)138° V5B45(42G)138° V4B45(35G)138° V8B45(60G)138° V3S35(20G)217° V4S35(35G)217° V5S35(42G)217° V8S35(60G)217° V4S35(40G)217° V4B48 [35G] 138℃ V4S38 [35G] 217℃

Quantity: Stock ( 119999988 )

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Product Name	Lead-Free Tin Paste Low Temperature And High Temperature Melting Point Tin Paste CPU Repair
Item NO.	1799986
Weight	0.07 kg = 0.1543 lb = 2.4692 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Creation Time	2023-02-26

V8B45 (60g) 138℃

V8S35 (60g) 217℃

V3B45 (20g) 138℃

V3S35 (20g) 217℃

V5B45 (42g) 138℃

V5S35 (42g) 217℃

V4B45 (40g) 138℃

V4S35 (40g) 217℃

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All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.