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Home>Repair Tools>Phone Repair Tools>Mainboard Repair Tools>MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal
MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal

MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal Item NO.: 3256805851410944

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Product Name MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal
Item NO. 3256805851410944
Weight 0.4 kg = 0.8818 lb = 14.1096 oz
Category Repair Tools > Phone Repair Tools > Mainboard Repair Tools
Brand MECHANIC
Creation Time 2023-09-13

MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal


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All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

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● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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