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MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal Item NO.: 3256805851410944
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| Product Name | MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal |
| Item NO. | 3256805851410944 |
| Weight | 0.4 kg = 0.8818 lb = 14.1096 oz |
| Category | Repair Tools > Phone Repair Tools > Mainboard Repair Tools |
| Brand | MECHANIC |
| Creation Time | 2023-09-13 |
MECHANIC Breakthrough iX5Ultra Universal Preheating Platform for Mobile Phone Motherboard Layered Bonding Glue Removal
Warranty Service
All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.
Please refer to the guide to get a RMA and initiate an after sales claim.
Scope of Warranty
● Order-related issues: Incorrect quantity, incorrect products and package damage.
● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.
● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.
After Sales Service Process
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