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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>MECHANIC Lead-free high/medium/low temperature solder paste for PCB SMT BGA Reballing Phone IC Chip Mainboard Repair with Putter

MECHANIC Lead-free high/medium/low temperature solder paste for PCB SMT BGA Reballing Phone IC Chip Mainboard Repair with Putter Item NO.: 9933762

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US$ 1.50 ~ US$ 1.63

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 1.59	US$ 1.54	US$ 1.50

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Product Name	MECHANIC Lead-free high/medium/low temperature solder paste for PCB SMT BGA Reballing Phone IC Chip Mainboard Repair with Putter
Item NO.	9933762
Weight	0.3 kg = 0.6614 lb = 10.5822 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Brand	MECHANIC
Creation Time	2023-02-26

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