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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste

MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste

MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste Item NO.: 817251_817256

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US$ 2.45 ~ US$ 2.67

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 2.61	US$ 2.53	US$ 2.45

Model

temperature: Low temperature Medium temperature

Quantity: Stock ( 5344 )

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Product Name	MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste
Item NO.	817251_817256
Weight	0.5 kg = 1.1023 lb = 17.6370 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Creation Time	2023-02-26

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All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process

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