Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>MaAnt BGA Reballing Stencil for IP 6-14 Pro MAX Motherboard CPU IC Chipping Planting Tin Template Soldering Steel Mesh
MaAnt BGA Reballing Stencil for IP 6-14 Pro MAX Motherboard CPU IC Chipping Planting Tin Template Soldering Steel Mesh

MaAnt BGA Reballing Stencil for IP 6-14 Pro MAX Motherboard CPU IC Chipping Planting Tin Template Soldering Steel Mesh Item NO.: 3256805768888177

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US$ 7.02
Color
for 5 5S 5C for 6 6P for 7 7P for 6s 6sP for 8 8P X for XS MAX XR for 11 Series for 12 Series for 13 Series for 14 Series For 5-14PM 7-14 Comprehensive 6S-14 Screen IC For 8-14PM
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Product Name MaAnt BGA Reballing Stencil for IP 6-14 Pro MAX Motherboard CPU IC Chipping Planting Tin Template Soldering Steel Mesh
Item NO. 3256805768888177
Weight 0.1 kg = 0.2205 lb = 3.5274 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Brand AMAOE
Creation Time 2023-09-13

MaAnt BGA Reballing Stencil for IP 6-14 Pro MAX Motherboard CPU IC Chipping Planting Tin Template Soldering Steel Mesh



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● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

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