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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series

MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series Item NO.: 11736279

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US$ 19.50 ~ US$ 21.20

Quantity	0-10	11-50	≥51
Discount	2% OFF	5% OFF	8% OFF
Price	US$ 20.77	US$ 20.14	US$ 19.50

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Product Name	MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series
Item NO.	11736279
Weight	0.3 kg = 0.6614 lb = 10.5822 oz
Category	Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag	BGA reballing kit
Brand	MAANT
Creation Time	2023-02-26

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series Item NO.: 11736279

Warranty Service

Scope of Warranty

After Sales Service Process

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