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Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series
MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series

MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series Item NO.: 11736279

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US$ 19.50 ~ US$ 21.20
Quantity 0-10 11-50 ≥51
Discount 2% OFF 5% OFF 8% OFF
Price US$ 20.77 US$ 20.14 US$ 19.50
Model
Complete set of base A8-A15 Base+HISILICON base+UALCOMM CPU Base+A8-A15+HISILICON+UALCOMM CPU
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Product Name MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A16 Qualcomm Huawei Hisilicone series
Item NO. 11736279
Weight 0.3 kg = 0.6614 lb = 10.5822 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Tag BGA reballing kit
Brand MAANT
Creation Time 2023-02-26

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