Home>HOME>Mijing KC8 Glue Removal Blade for Mobile Phone CPU NAND Motherboard BGA IC Chip Scraper Knife Rear Glass Disassembly Hand Tools
Mijing KC8 Glue Removal Blade for Mobile Phone CPU NAND Motherboard BGA IC Chip Scraper Knife Rear Glass Disassembly Hand Tools

Mijing KC8 Glue Removal Blade for Mobile Phone CPU NAND Motherboard BGA IC Chip Scraper Knife Rear Glass Disassembly Hand Tools Item NO.: 34634757

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Product Name Mijing KC8 Glue Removal Blade for Mobile Phone CPU NAND Motherboard BGA IC Chip Scraper Knife Rear Glass Disassembly Hand Tools
Item NO. 34634757
Weight 0.56 kg = 1.2346 lb = 19.7534 oz
Category HOME
Creation Time 2024-01-27

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

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