Home>Repair Tools>Phone Repair Tools>BGA Reballing Kit>Original imported lead-free Japanese thousand living tin paste low temperature medium temperature high temperature BGA thousand column solder paste tin paste mud
Original imported lead-free Japanese thousand living tin paste low temperature medium temperature high temperature BGA thousand column solder paste tin paste mud

Original imported lead-free Japanese thousand living tin paste low temperature medium temperature high temperature BGA thousand column solder paste tin paste mud Item NO.: 22380890

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US$ 21.01
Model
138u00b0 260u00b0 183u00b0
Quantity

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Product Name Original imported lead-free Japanese thousand living tin paste low temperature medium temperature high temperature BGA thousand column solder paste tin paste mud
Item NO. 22380890
Weight 0 kg = 0.0000 lb = 0.0000 oz
Category Repair Tools > Phone Repair Tools > BGA Reballing Kit
Creation Time 2023-06-19



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● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

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