Language: English

0Cart

Help

View More: Brand; Machines; Phone Repair Tools; Microscopes; Time Line; Unlock Device

View More: Function; Model; Screen parts; Inner parts; Motherboard parts; Back cover parts; Parts Classify

View More: Phone Case; Adapters & Cables; Battery; Phone Lens; Phone Film; Power Bank; Phone Stickers; Headset; Holder; Selfie Stick

View More: CD Player; Game Console; Speakers; Microphone; Walkman; Headphones; Мр3/Мр4

View More: Usb Peripherals; Computer Peripherals; Digital Case; Digital Battery; Stylus; U Disk; Hard Disk; Flat Film; Digital Storage; Bracket

View More: Smart Watch; Children's Smart Watch; Drone; Smart Health

View More

Currency: US$

Language: English

Home>Repair Tools>RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit

RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit Item NO.: 23243423

Write a Review Sold (2464)

US$ 17.80

Quantity: Stock ( 9999999 )

Estimate Shipping Cost

Product Name	RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit
Item NO.	23243423
Weight	0.3 kg = 0.6614 lb = 10.5822 oz
Category	Repair Tools
Tag	RELIFE RL-044
Brand	LIGHTSPEED
Creation Time	2024-03-15

RELIFE RL-044 BGA Reballing Stencil For iPhone Samsung Huawei Xiaomi Mobile Mainboard IC Chip Repair Tin Template Soldering Kit

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.