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SP-X Middle Layer BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin flux Item NO.: 21406774
Quantity | 0-10 | 11-50 | ≥51 |
Discount | 2% OFF | 5% OFF | 8% OFF |
Price | US$ 4.56 | US$ 4.42 | US$ 4.28 |
- Quantity
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CopyProduct Name | SP-X Middle Layer BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin flux |
Item NO. | 21406774 |
Weight | 0 kg = 0.0000 lb = 0.0000 oz |
Category | Repair Tools > Phone Repair Tools > BGA Reballing Kit |
Tag | BGA reballing kit |
Creation Time | 2023-02-26 |
Product Name | SP-X Middle Layer BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin flux |
Item NO. | 1311967 |
Tools and Consumables | Solder paste flux |
Weight | 0.18kg = 0.3968 lb = 6.3493 oz |
Category | Phone repair tools> BGA reballing kit |
Tag | solder paste solder paste flux soldering paste SP-X SPX Relife solder paste X solder paste middle layer solder paste motherboard middle layer solder paste SP X |
Brand | RELIFE |
Creation Time | 2020-06-12 |
Warranty Service
All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.
Please refer to the guide to get a RMA and initiate an after sales claim.
Scope of Warranty
● Order-related issues: Incorrect quantity, incorrect products and package damage.
● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.
● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.
After Sales Service Process
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