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Home>Repair Tools>XZZ L23-CPU BGA Reballing Stencil Platform For iPhone A8-A15 for Hisilicon Qualcom Phone BGA Universal Reballing Stencil

XZZ L23-CPU BGA Reballing Stencil Platform For iPhone A8-A15 for Hisilicon Qualcom Phone BGA Universal Reballing Stencil Item NO.: 3474746

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US$ 15.00

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Quantity: Stock ( 19999998 )

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Product Name	XZZ L23-CPU BGA Reballing Stencil Platform For iPhone A8-A15 for Hisilicon Qualcom Phone BGA Universal Reballing Stencil
Item NO.	3474746
Weight	0.86 kg = 1.8960 lb = 30.3356 oz
Category	Repair Tools
Creation Time	2024-01-31

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