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Home>Repair Tools>XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools

XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools Item NO.: 548343

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Product Name	XZZ Xinzhizao L23 BGA Reballing Stencil Platform For iPhone A8-A15 Motherboard MTK EMMC Qualcomm HUAWEI CPU Welding Repair Tools
Item NO.	548343
Weight	0.51 kg = 1.1244 lb = 17.9897 oz
Category	Repair Tools
Tag	XZZ Xinzhizao , ZZ Xinzhizao L23
Creation Time	2024-01-19

Brand Name: XZZ L23

MAGNETODYNAMIC TINPLANTING PLATFORM

Support lP series, Hisilicon series, Qualcomm series, etc

BGA maintenance positioning

Strong magnetic adsorption

Simple operation

Precise positioning

Imported synthetic stone

thermostability

Antistatic

Automatic precise

positioning

New magnetic dynamic original positioning

Strong magnetic force automatic clamping, convenient

and flexible, supporting a variety of

CPU maintenance positioning and firm clamping

Magnetomotive force

Automatic and flexible, stable clamping,slide open the card and put the chipaccuratelyolt

can be automatically clamped by magnetic force when it is rele

ased , and the operation is simple and convenient

Installation method

Step 1:

Prepare the tin planting platform and close the chip with a smalltriangleFixed on the clamping position

(Note: it shall be consistentwith the direction of steel mesh)

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.