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Home>Repair Tools>i2C Syn14 18in1 Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X-14 Pro Max Repair

i2C Syn14 18in1 Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X-14 Pro Max Repair Item NO.: 2365012

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Product Name	i2C Syn14 18in1 Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X-14 Pro Max Repair
Item NO.	2365012
Weight	0.12 kg = 0.2646 lb = 4.2329 oz
Category	Repair Tools
Tag	Plant , i2C Syn14
Creation Time	2023-12-15

Syn14 Mid layer tin planting table, 18in1 Universal version support, X-14PM full range of models

Warranty Service

All products manufactured or supplied by LIGHTSPEEDTOOLS.COM are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.

Please refer to the guide to get a RMA and initiate an after sales claim.

Scope of Warranty

● Order-related issues: Incorrect quantity, incorrect products and package damage.

● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.

● Purchases from unauthorized resellers, products without LIGHTSPEEDTOOLS stamp, artificial defects and products out of warranty are not included.

After Sales Service Process

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i2C Syn14 18in1 Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X-14 Pro Max Repair Item NO.: 2365012

Syn14 Mid layer tin planting table, 18in1 Universal version support, X-14PM full range of models

Warranty Service

Scope of Warranty

After Sales Service Process

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